Where is AOI used? What defects can be detected? And method

（1）AOI使用的场合

①印刷后AOI

②贴片后AOI

③焊接后AOI

（2）AOI能够检测的缺陷

①印刷后AOI：桥接、坍塌、焊膏过多、焊膏过少、无焊膏等

②贴片后AOI：元器件漏贴、元器件极性贴反、偏移、侧立等

③焊接后AOI：桥接、立碑、错位、焊点过大、焊点过小等

(1) the occasion of 1)AOI use

① AOI after printing

② AOI after pasting

③ AOI after welding

(2) defects that can be detected by 2)AOI

① AOI after printing: bridging, collapse, too much solder paste, too little solder paste, no solder paste, etc

② AOI after mounting: missed mounting of components, reversed polarity of components, offset, standing sideways, etc.

③ After welding, AOI: bridging, erecting monument, dislocation, too large solder joint, too small solder joint, etc.