How to solder SMT chip component devices?

2022-05-18 196

Customer concerns this is a simple hand-mounted soldering sequence table. It is designed to enable those without any surface mount soldering experience to be able to solder smd components. First of all we need to prepare the following tools soldering iron one with temperature control, highly recommended.

 Fine soldering iron bits (e.g. only 1mm) I use one that is this shape for 1mm across tip: (this is a good shape for "dragging a soldering fine pitch IC) soldering iron sponge If you are not ready in the working habit of using clean bits, you are going to become this! Good lighting is obviously physical, but very helpful. Place small parts with fine forceps. The tip implements useful push widgets into place and keeps them there while welding. I recommend something like this cheap welding aid setup with two straight and curved tips. A powerful magnifying glass for the final inspection of solder joints. I personally use a scan lens from an old fax machine that has a very high magnification salvage. Very fine no-wash (28swg/0.38 mm or more) "no cleaning" is important. Another method is to use organic flux and clean thoroughly and immediately after soldering, but no cleaning is just easier! No-wash flux gel or no-wash flux pen gel is best you get in the pen because it is a bit tacky and helps to put the components in place for liquid flow. The gel can be applied with a small screwdriver or a matchstick. Fine no-eluting solder braid for removal of the bridge between IC pins. Also note that some of the "unclean" desolder braids contain rosin flux. 1. The soldering iron temperature tends to work quite well at the temperature of the hot soldering iron (about 375 ° C), making things faster and requiring the fine distance IC to solder the following techniques to work. The actual temperature setting will vary from iron to iron, but it may be 330° between C/626°F to 380°C/716°F (although there are some inexpensive temperature-controlled soldering iron temperature settings that may not necessarily be very accurate if it doesn't work well, so try to be higher). Most modern components with considerable elasticity are designed to cope with automatic soldering and lead-free solder, but at these higher temperatures even such work try not to leave contact with the iron for too long, how SMT chip component devices are soldered 2, soldering 0805 chip resistors and capacitors coated with flux to two pads. Implement the position of the component with forceps and/or tips. Load some solder into the soldering iron tip. While using the tip to achieve keep the element in place, touch the soldering iron to one end of the assembly so that the solder flows to the pad and component ends. Then load some solder into the brazed soldering tip and repeat it with the other end of the part (at which point it does not need to stay in place). It is good to use a magnifying glass to inspect the joints, and there are no pads or components near the welded bridge for visual inspection. 3. Solder SOT-23 transistors coated with flux all 3 pads. Implement the position of the component with forceps and/or tips. Load some solder into the soldering iron tip. While with the tip to achieve keep the elements in place, touch the soldering iron to the middle pin /pad so the solder flows to the pad and pin. Then repeat this process to the other 2 pins (it won't take this time to hold in place). It is good to use a magnifying glass to inspect the joints, and there are no pads or components near the welded bridge for visual inspection. 4, Solder medium pitch IC (i.e. 1.27mm pitch SRAM core) coated with flux all pads. Implement the position of the component with forceps and/or tips. Load solder volumes as small as brazed soldering iron tips. While gently fixing the components in place, touch the soldering iron to the corner pin 1 so the solder flows to the pad and pin. Check component alignment. In the same way as the diagonal welding needle. Check the component alignment again. Solder each pin, either by applying a very fine solder iron to each pin or by loading the solder and then touching the iron on each pin. If you end the tin bridge between the pins, remove the soldering tip by dragging between the pins, or by using some very thin braids to desolder the soldering tip. Visual inspection removes shorts with a magnifying glass joint and, if necessary, desoldering the weave. 5. Solder fine pitch ICs (i.e. the rest of SMTIC) apply a large amount of flow to all pads. Implement the position of the component with forceps and/or tips. Load a very small amount of solder into the brazing tip. While gently fixing the components in place, touch the soldering iron to the corner pin 1 so the solder flows to the pad and pin. Check component alignment. In the same way as the diagonal welding needle. Check the component alignment again. Load the amount of solder as small as the brazed soldering tip and steadily drag between the pins at one end to the other. The flux causes the solder to flow to the pin and pad and does not nictate. In case of insufficient solder for the joint, repeat the process in these joints. If you use too much solder you may end up between the pins of the tin bridge. These can be removed using some very fine desoldering braids, or simply by dragging the soldering iron tip along the tip of the pin to less solder the pin. Visual inspection removes shorts with a magnifying glass joint and, if necessary, desoldering the weave.