SMT workshop job responsibilities

2022-06-24 28

 Printer 1.Check whether the PCB panel has a slot before printing.Check whether the PCB has a white oil map deviation or a white oil map deviation.2.Adjust the appropriate printing speed to ensure the normal production of the placement machine.3. Send the plate with the printed solder paste to the placement machine correctly to ensure that the placement machine can produce normally; 4. Check whether the solder paste has an accurate seal and pick out the defective products; 5. Print the solder paste accurately on the printing board. And to ensure that the solder paste does not seriously collapse, the edges are neat. No short circuit and other undesirable phenomena. If found, the washing plate is re-printed.6.Pay attention to the performance of the solder paste in the printing.SMT patch processing plant two, the patch operator 1.The operator conducts self-inspection and inspection of the production line responsible for 2.Replace the material in time, and fill in the change record book, notify the IPQC for verification; 3. Responsible for feeding when changing lines in production; 4. Prepare the materials in advance when changing the production line; 5. Preparation of materials in production; 6. Deal with simple alarms that appear during production of machinery and equipment; 7. Material verification every two hours and commuting. Third, the furnace before the visual inspection 1. check whether the missed paste or the component distortion and correction (the MISSed PCB must be marked); 2. For the timely feedback of the placement abnormality; 3. Prepare the material when the production is changed, and do a good job of marking the bulk material; 4. The board that encounters the label of the replacement material must check the sample; 5. When replenishing parts, the unmarked components should be taken from the tray. and indicate the code number of the patch; 6. Combine the samples once every hour. Fourth, the furnace after the visual inspection 1.Inspection from the reflow soldering out of the printed board, the phenomenon of poor welding maintenance; 2. The components disassembled from the scrap board should be checked to see if there is a short circuit of tin slag at the bottom. If it cannot be cleaned up, it is scrapped.3. When manual patching, the unmarked components must be taken from the tray.4.The deviation, wrong parts, etc. may be caused by the machine reasons should be immediately explained to the main operator.5.When breaking the board, it is necessary to carefully check the batch number and the integrity of the board; 6. Pay attention to the way of arranging the board, as far as possible so that the side with fewer components is inserted into the turnover row. And the component can not be stuck in the card slot.7. If an abnormal situation is found, the relevant personnel must be notified immediately; 5. Inspection 1. Inspect the printed board flowing out of the reflow soldering and inspect the maintenance products; 2. Material verification every two hours and commuting. Check in time when there is a change of material; 3. If abnormal situations are found, report to the relevant personnel in a timely manner; 4. Pay attention to the layout method, as far as possible so that the side with few components is inserted into the turnover row