Package list of common electronic components

2022-10-26 47

Main classification description Sub-classification Sub-classification description DIP is sometimes referred to as "DIL". On this website, they are collectively referred to as "DIP", which is a through-hole mounting type package with guiding pins drawn out from both sides of the package. Although the pin pitch is usually 2.54 mm (100 mils), some packages have a pin pitch of 1.778 mm (70 mils). DIP has 6-64 pins, and the package width is usually 15.2mm (600ml), 10.16mm (400ml), or 7.62mm (300ml), but please note that the package length will be different even if the number of pins is the same. DIP (Dual In-line Package) Plastic DIP package. Sometimes referred to as "PDIP", but they are collectively referred to as "DIP" on this website. CDIP (ceramic DIP) ceramic DIP package. Sometimes referred to as "CERDIP", but they are collectively referred to as "CDIP" on this website. WDIP (Window DIP) A DIP package with a transparent window to eliminate ultraviolet rays, usually a ceramic package sealed with glass. The description of different manufacturers may be different, but ST (ST Microelectronics) company calls it "FDIP". On this website, they are collectively referred to as "WDIP". Power DIP is a type of DIP package that can dissipate the heat generated by IC through pins. Most of these packages use pins collectively referred to as ground terminals in a circle around the center. SIP is sometimes referred to as "SIL", but they are collectively referred to as "SIP" on this website, which is a kind of through-hole mounting type package with guiding pins drawn out from one side of the package. When mounted on a printed circuit board, it is perpendicular to the circuit board. SIP (Single In-line Package) has 2-23 pins, with many different shapes and pin pitches. Please note that many of them have special shapes with heat dissipation structure. In addition, it has no obvious difference with TO220. ZIP (Z-shaped in-line package) leads from one side of the package are bent into a staggered shape in the middle. The pin pitch on one side of the package is 1.27 mm (50 mils), but it will become 2.54 mm (100 mils) when inserted into the printed circuit board. Have 12-40 pins. QFP is a type of surface mount package, in which pins are led out from four sides of the package. It is characterized in that the lead is gull-wing ("L"-shaped). Has a variety of stitch spacings: 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm and 0.3mm. Its name is sometimes confused. The disadvantage of QFP package is that the pins are very easy to bend when the pin spacing is reduced. QFP (Four-sided Pin Flat Package) This description is commonly used in standard QFP packages. The pitch of the pins of FQFP (Fine pitch QFP) is less than 0.65mm. Some manufacturers use this name. HQFP (QFP with heat sink) QFP package with heat sink. LQFP (Thin QFP) A thin QFP package with a thickness of 1.4mm. MQFP (Metric QFP) is a QFP classification that conforms to JEDEC (United States Joint Electronic Equipment Committee) standard. It is a standard QFP package with a pin spacing of 1.0 ~ 0.65 mm and a body thickness of 3.8 ~ 2.0 mm. MQFP (Ultra-thin QFP) is an ultra-thin QFP package with a height of 1.27 mm (50 mils) or less when it is mounted on a printed circuit board. The thickness of the package body is about 1.00mm, and it has a variety of pin pitches: 0.8mm, 0.65mm, 0.5mm and 0.4mm. Has 44–120 pins. VQFP (Micro QFP) is a kind of small QFP package with a pin pitch of 0.5mm. The thickness of the package body is about 1.5mm.. It is currently included in the LQFP classification, but some manufacturers still use the name. J-shaped lead surface mount package. It is characterized in that the lead is J-shaped. Compared with QFP and other packages, J-shaped leads are not easily deformed and easy to operate. SOJ (Small Profile J-Lead Package) pins are led out from both sides of the package. It is called this name because the lead is shaped like the letter "J". Usually made of plastic, it is commonly used in LSI memory, such as DRAM, SRAM, etc. The stitch spacing is 1.27 mm (50 mils). Have 20–40 pins. PLCC (Plastic Chip Carrier with Leads) is a type of plastic package in which J-shaped pins are led out from four sides of the package. The stitch spacing is 1.27 mm (50 mils) and it has 18-84 stitches. This name is also used in QFJ and JEITA standards. CLCC (Ceramic Chip Carrier with Leads) is a type of ceramic package in which J-shaped pins are led out from four sides of the package. Packages with windows are used for ultraviolet elimination EPROM microcomputer circuits and microcomputer circuits with EPROM, etc. TSOC is a SOJ package with fewer pins. Like SOJ, the stitch spacing is 1.27mm (50mil), but the main body size is smaller. Grid leads are arranged in grid shape on one side of the package, which can be divided into two types: via-hole mounting PGA type and surface mounting BGA type. PGA (Pin Grid Array) is one of the through-hole mounting packages. This is a type of package that uses array pins to be vertically attached to the bottom of the package (like a nail brush). When the name of the material is not specified, ceramic PGA package is often used. Used for high-speed and large-scale logic LSI, with a pin pitch of 2.54mm (100mil) and 64–447 pins. In addition, there is plastic PGA package, which can be used as a packaging substrate instead of glass epoxy resin printed circuit board to reduce the cost. PGA (ball grid array) is a type of surface mount package, which uses ball solder joints on the back of printed circuit board instead of array leads. The LSI is attached to the surface of the printed circuit board and sealed with molding resin or filling material. It is an LSI package with no less than 200 pins. The size of the package body can be smaller than QFP, and there is no need to worry about deformation of leads. Because its lead inductance is smaller than QFP, it can be used for high-speed LSI packaging. It is currently used in logic LSI(225-350 pins) and high-speed SRAM (119 pins, etc.). SMD is a small BGA package developed by NationalSemiconductor Company in the United States, which has 4–42 pins. "SO" stands for "Small Outline". It refers to a surface mount package in which gull-wing (L-shaped) leads are led out from both sides of the package. There are various descriptions of these package types. Note that even packages with the same name may have different shapes. SOP (Small Form Factor Package) In JEITA standard, such packages with a pin pitch of 1.27mm (50mil) are called "SOP" packages. Please note that "SOP" packages referred to in JEDEC standard have different widths. SOIC (Small Form Factor Integrated Circuit) is sometimes called "SO" or "SOL", but they are collectively referred to as "SOIC" on this website. In JEDEC standard, such packages with a pin pitch of 1.27mm (50mil) are called "SOIC" packages. Please note that "SOIC" packages referred to in the JEITA standard have different widths. MSOP (Mini (Micro) SOP) is a small SOP package with a pin pitch of 0.65mm or 0.5mm. The Analog Devices company calls it "microSOIC", Maxim company calls it "SO/uMAX" and National Semiconductor company calls it "MiniSO". In addition, it can also be considered as SSOP or TSSOP. QSOP (1/4 SOP) is a small SOP package with a pin pitch of 0.635mm (25mil). SSOP (Reduced SOP) is a small SOP package with a pin pitch of 1.27 mm (50 mil). SSOP has stitch spacing of 1.0mm, 0.8mm, 0.65mm and 0.5mm, and has 5–80 stitches. They are widely used as small surface mount packages. TSOP (Ultra-Thin SOP) is an ultra-thin small form factor package. A SOP package with a mounting height of 1.27 mm (50 mils) or less and a pin pitch of 1.27 mm or less. Has 24–64 pins. TSOP can be divided into two types: one is that the lead terminals are attached to the shorter side of the package (the pin pitch is 0.6mm, 0.55mm or 0.5mm), and the other is that the lead terminals are attached to the longer side of the package (the pin pitch is usually 1.27mm). In the JEITA standard, the former is called "Type I" and the latter is called "Type II". TSSOP (Ultra-Thin Reduced SOP) is an ultra-thin SSOP package with a thickness of 1.0mm. The stitch spacing is 0.65mm or 0.5mm, with 8-56 stitches. TSSOP (heat sink TSSOP) provides a heat dissipation surface called "heat sink" on the surface of the mounting end of the tssop board. CERPAC is a ceramic sealed package with a pin pitch of 1.27 mm (50 mil). A package developed by DMP New Japan Radio (this website is abbreviated as "NJR"). The pin pitch is 1.27mm (50mil), which is similar to SOP and SOIC, but the package width is different. SC70 can also be regarded as a kind of SSOP package, which is a small surface mount package with a pin pitch of 0.65mm. Most of them have 5 pins, but some have 6 pins. Depending on the manufacturer, it is also called "USV" or "CMPAK". "SOT" stands for "Small Outline Transistor", which was originally a small transistor surface mount package. Even if it has the same shape as SOT, different manufacturers may use different names. Small surface mount package with SOT23 pin pitch of 0.95mm. Have 3–6 pins. It is also called "SC74A", "MTP5", "MPAK" or "SMV" depending on the manufacturer. SOT89 is a small surface mount package with 1.5mm pin pitch and heat sink. Most have 3 pins, but some have 5 pins. Depending on the manufacturer, it is also called "UPAK". The SOT143 is a small surface mount package with a pitch of 1.9mm. Has 4 pins, one of which is wider than the other pins. SOT223 is a small surface mount package with 2.3mm pin pitch and heat sink. Has three pins. "TO" stands for "Transistor Outline". It was originally a transistor package, which was designed to enable leads to be molded and used for surface mounting. Even if it has the same shape as TO, different manufacturers may use different names. A package used by TO3P voltage regulator, etc., originally a kind of transistor package. TO92 is a kind of package for voltage regulators, voltage reference components, etc. It was originally a kind of transistor package. It can be divided into many different package types, such as "mini-size" and "long-body" packages. In JEDEC standard, it is also called "TO226AA". A package used by TO220 voltage regulator, etc., originally a transistor package. It has a tab for attaching to the heat sink. It also includes solid molding package, in which the connector is coated with plastic. It is also divided into different types with many pins, which are used for amplifiers, etc. Penta Watt (5 pins), Hepta Watt (7 pins) and MULTIWATT (multiple pins) of ST Microelectronics are classified as TO220 packages, but they can also be regarded as a kind of SIP packages. A package used by TO252 voltage regulator, etc., originally a transistor package. Some manufacturers also refer to long lead parts as "SC64". Packages designed to enable leads to be molded and used for surface mounting are also called "DPAK", "PPAK" or "SC63" by some manufacturers. The TO263 package is similar to the TO220 package, but uses a smaller tab. Generally, it is intended to enable the leads to be molded and used for surface mounting. Besides 3 stitches, there are 5 stitches and 7 stitches. Also known as "D2PAK (DDPAK)". One of the metal shell type packages. No surface mount components. The leads are plugged into the printed circuit board. It is rarely used at present. TO3 An early power transistor package. Use two screws to fix it on the heat sink. 5 A cylindrical metal package with a diameter of 8mm and a height of 4mm. Similar to T039. TO39 A cylindrical metal package with a diameter of 8mm and a height of 4mm. Similar to T05. TO46 A cylindrical metal package with a diameter of 5mm and a height of 2.5mm.. Slightly shorter than TO52. TO52 A cylindrical metal package with a diameter of 5mm and a height of 3.5mm.. Slightly higher than TO46. TO99 A cylindrical metal package with a diameter of 8mm and a height of 4mm. Eight pins form a circle at the bottom, and its center is a 1mm protrusion, so that the bottom is higher than the printed circuit board. Its appearance is similar to TO100. TO100 is a cylindrical metal package with a diameter of 8mm and a height of 4mm. Ten pins form a circle at the bottom, with a 1mm protrusion at the center, so that the bottom is higher than the printed circuit board. Its appearance is similar to TO99.